
Michael Faraday describes the “extraordinary case” of his discovery of electrical conduction increasing with temperature in silver sulfide crystals. This is the opposite to that observed in copper and other metals.

In the first written description of a semiconductor diode, Ferdinand Braun notes that current flows freely in only one direction at the contact between a metal point and a galena crystal.

Radio pioneer Jagadis Chandra Bose patents the use of a semiconductor crystal rectifier for detecting radio waves.

Julius Lilienfeld files a patent describing a three-electrode amplifying device based on the semiconducting properties of copper sulfide. Attempts to build such a device continue through the 1930s.

Alan Wilson uses quantum mechanics to explain basic semiconductor properties. Seven years later Boris Davydov (USSR), Nevill Mott (UK), and Walter Schottky (Germany) independently explain rectification.

Russell Ohl discovers the p-n junction and photovoltaic effects in silicon that lead to the development of junction transistors and solar cells.

Techniques for producing high purity germanium and silicon crystals are developed for wartime radar microwave detectors.

John Bardeen & Walter Brattain achieve transistor action in a germanium point-contact device in December 1947.

William Shockley conceives an improved transistor structure based on a theoretical understanding of the p-n junction effect.

Herbert Mataré & Heinrich Welker independently create a germanium point-contact transistor in France.

Gordon Teal grows large single crystals of germanium and works with Morgan Sparks to fabricate an n-p-n junction transistor.

William Pfann and Henry Theurer develop zone refining techniques for production of ultra-pure semiconductor materials.

Bell Labs technology symposia and licensing of transistor patents encourages semiconductor development.

Semiconductors appear in battery-powered hearing aids and pocket radios where consumers are willing to pay a premium for portability and low power consumption.

A transistorized computer prototype demonstrates the small size and low-power advantages of semiconductors compared to vacuum tubes.

Morris Tanenbaum at Bell Labs builds the first silicon transistors but Texas Instruments demonstrates and markets the first commercial devices.

Following the production of solar cells using high-temperature diffusion methods, Charles Lee and Morris Tanenbaum apply the technique to fabricate high-speed transistors.

Carl Frosch and Lincoln Derick grow a silicon dioxide film on wafers to protect their surface and allow controlled diffusion into the underlying silicon.

Jules Andrus and Walter Bond adapt photoengraving techniques from printing technology to enable precise etching of diffusion “windows” in silicon wafers.

Shockley Semiconductor Laboratory develops Northern California's first prototype silicon devices while training young engineers and scientists for the future Silicon Valley.

Leo Esaki’s novel device is an example of many celebrated semiconductor breakthroughs that do not sustain their early promise as they are overtaken by competing technologies.

Fairchild Semiconductor produces double-diffused silicon mesa transistors to meet demanding aerospace applications.

Jack Kilby produces a microcircuit with both active and passive components fabricated from semiconductor material.

Jean Hoerni develops the planar process to solve reliability problems of the mesa transistor, thereby revolutionizing semiconductor manufacturing.

Robert Noyce builds on Jean Hoerni’s planar process to patent a monolithic integrated circuit structure that can be manufactured in high volume.

Jay Last leads development of the first commercial IC based on Hoerni’s planar process and Noyce’s monolithic approach.

John Atalla and Dawon Kahng fabricate working transistors and demonstrate the first successful MOS field-effect amplifier.

Development of thin-film crystal-growth process leads to transistors with high switching speeds.

Computer architect Seymour Cray funds development of the first silicon device to meet the performance demands of the world’s fastest machine.

Semiconductor and independent vendors build dedicated test equipment for high-throughput manufacturing.

The size, weight, and reduced power consumption of integrated circuits compared to discrete transistor designs justify their higher cost in military and aerospace systems.

Frank Wanlass invents the lowest power logic configuration but performance limitations impede early acceptance of today's dominant manufacturing technology.

Diode Transistor Logic (DTL) families create a high-volume market for digital ICs but speed, cost, and density advantages establish Transistor Transistor Logic (TTL) as the most popular standard logic configuration by the late 1960s.

Multi-chip SLT packaging technology developed for the IBM System/360 computer family enters mass production.

General Microelectronics uses a Metal-Oxide-Semiconductor (MOS) process to pack more transistors on a chip than bipolar ICs and builds the first calculator chip set using the technology.

David Talbert and Robert Widlar at Fairchild kick-start a major industry sector by creating commercially successful ICs for analog applications.

Fairchild’s Director of R & D predicts the rate of increase of transistor density on an integrated circuit and establishes a yardstick for technology progress.

Burroughs and RCA announce the first mainframe computer families based on monolithic integrated circuit technology.

The Dual In-line Package (DIP) format significantly eases printed circuit board layout and reduces computer assembly cost.

Factory-programmable read-only-memories (ROMs) generate the first integrated circuit random access memory applications.

Sixteen-bit bipolar devices are the first ICs designed specifically for high speed read/write memory applications.

IBM engineers pioneer computer-aided electronic design automation tools for reducing errors and speeding design time.

Third-party vendors develop specialized knowledge of semiconductor fabrication and emerge as vendors of process technology and turnkey manufacturing facilities.

Automated design tools reduce the development engineering time to design and deliver complex custom integrated circuits.

The precision manufacturing requirements of combining analog and digital capability on one chip made them one of the last product areas to yield to monolithic solutions.

Federico Faggin and Tom Klein improve the reliability, packing density, and speed of MOS ICs with a silicon-gate structure. Faggin designs the first commercial silicon-gate IC – the Fairchild 3708.

Design innovation enhances speed and lowers power consumption of the industry standard 64-bit TTL RAM architecture. Is quickly applied to new bipolar logic and memory designs.

The Intel i1103 Dynamic RAM (DRAM) presents the first significant semiconductor challenge to magnetic cores as the primary form of computer memory.

Dov Froman’s ultra-violet light erasable ROM design offers an important design tool for the rapid development of microprocessor-based systems, called an erasable, programmable read-only-memory or EPROM.

Intel engineers, led by Federico Faggin, implement Ted Hoff’s architectural concept to create the i4004 single-chip implementation of a computer central processing unit (CPU), now called a micro-processor unit or MPU.

A single-chip calculator design emerges as the TMS 1000 micro-control unit or MCU, a concept that spawned families of general-purpose digital workhorses that power the tools and toys of the developed world.

The Microma liquid crystal display (LCD) digital watch is the first product to integrate a complete electronic system onto a single silicon chip, called a System-On-Chip or SOC.

IBM researcher Robert Dennard’s paper on process scaling on MOS memories accelerates a global race to shrink physical dimensions and manufacture ever more complex integrated circuits.

John Birkner and H. T. Chua of Monolithic Memories develop easy-to-use programmable array logic (PAL) devices and tools for fast prototyping custom logic functions.

Bell Labs' single-chip DSP-1 Digital Signal Processor device architecture is optimized for electronic switching systems.
Source : http://www.computerhistory.org/semiconductor/timeline.html
1 comment:
It's great opportunity to learn smth about tunnel diode. It will help you to understand other aspects of this tech.
Post a Comment